The authors have designed and fabricated AFM probes with an integrated resistive temperature sensor and a grooved cantilever structure. The grooved structure compensates for the bilayer thermal bending that normally occurs during scanning thermal microscopy of hot samples. These new probes show reduced bending at high temperatures when compared to commercial, conventional cantilever probes with a similar stiffness. This indicates that the mechanical balance introduced by the grooved structure plays a major role in reducing thermal bending. Successful temperature mapping is demonstrated on an active heater device reaching 108 °C, a sample that would be beyond the imaging capability of conventional probes.
Zhang Y, Dobson P S and Weaver J M R 2012 “High temperature imaging using a thermally compensated cantilever resistive probe for scanning thermal microscopy” Journal of Vacuum Science & Technology B 30, 010601 (2012) https://doi.org/10.1116/1.3664328